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  december 2009 doc id 9346 rev 3 1/7 7 STTH310 high voltage ultrafast rectifier features low forward voltage drop high reliability high surge current capability soft switching for reduced emi disturbances planar technology description the STTH310, which uses st ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. table 1. device summary i f(av) 3 a v rrm 1000 v t j 175 c v f (max) 1.42 v t rr (max) 75 ns smc STTH310s do-201ad c2 STTH310 do-201ad STTH310 www.st.com
characteristics STTH310 2/7 doc id 9346 rev 3 1 characteristics to evaluate the conduction losses use the following equation: p = 1.20 x i f(av) + 0.075 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 1000 v i f(av) average forward current, = 0.5 t l = 75 c, = 0.5 do-201ad 3 a t l = 75 c, = 0.5 smc 3 i fsm forward surge current t p = 8.3 ms sinusoidal do-201ad 55 a smc 45 t stg storage temperature range - 50 to + 175 c t j maximum operating junction temperature + 175 c table 3. thermal parameters symbol parameter value unit r th(j-l) junction to lead l = 10 mm do-201ad 20 c/w smc 20 r th(j-a) junction to ambient l = 10 mm do-201ad 75 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r reverse leakage current t j = 25 c v r = v rrm --10 a t j = 125 c - - 50 v f forward voltage drop t j = 25 c i f = 3 a --1.7 v t j = 150 c - 0.98 1.42 table 5. dynamic electrical characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time i f = 0.5 a, i rr = 0.25 a i r = 1 a, t j = 25 c - - 75 ns t fr forward recovery time i f = 3 a, di f /dt = 50 a/s v fr = 1.1 x v fmax , t j = 25 c --300ns v fp forward recovery voltage - - 12 v
STTH310 characteristics doc id 9346 rev 3 3/7 figure 5. thermal resistance junction to ambient versus copper surface under each lead figure 1. conduction losses versus average current figure 2. forward voltage drop versus forward current p(w) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i (a) f(av) t =tp/t tp = 1 = 0.05 = 0.5 = 0.2 = 0.1 i (a) fm 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 t =25c (maximum values) j v (v) fm t =150c (maximum values) j t =150c (typical values) j figure 3. relative variation of thermal impedance junction ambient versus pulse duration (do-201ad) figure 4. relative variation of thermal impedance junction ambient versus pulse duration (smc) z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 = 0.5 = 0.2 = 0.1 single pulse t =tp/t tp t (s) p epoxy printed circuit board, fr4, l = 10 mm leads z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse epoxy printed circuit board, fr4, s = 1cm 2 r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 012345 smb do-201ad l =10mm leads s(cm2) epoxy printed circuit board, fr4, copper thickness = 35 m
package information STTH310 4/7 doc id 9346 rev 3 2 package information epoxy meets ul94, v0 band indicates cathode cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 6. footprint, dimensions in mm (inches) table 6. smc dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b (1) 1. dimensions b and c apply to plated leads 2.90 3.20 0.114 0.126 c (1) 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 e c l e2 e1 d a1 a2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14
STTH310 package information doc id 9346 rev 3 5/7 table 7. do-201ad dimensions ref. dimensions millimeters inches min. max. min. max. a - 9.50 - 0.374 b 25.40 - 1.000 - c - 5.30 - 0.209 d - 1.30 - 0.051 e - 1.25 - 0.049 notes 1 - the lead diameter ? d is not controlled over zone e 2 - the minimum length which must stay straight between the right angles after bending is 0.59"(15mm) table 8. do-201ad c2 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a - - 9.5 - - 0.374 b 13.75 - 17.75 0.541 - 0.699 c - - 5.3 - - 0.208 d - - 1.3 - - 0.051 e 3.1 3.6 4.1 0.122 0.142 0.161 f 2.4 3.15 3.9 0.094 0.124 0.153 g - 1.6 - - 0.063 - h 14.9 - 15.6 0.587 - 0.614 i 0.5 0.6 0.8 0.019 0.024 0.031 j - 18.78 - - 0.739 - k 3.8 - 4.8 0.150 - 0.189 note the difference between e dimensions on both sides of resinous body (which express the bending centering) must not be larger than 0.7 millimeter. ?c ?d a ee note 2 note 1 note 1 bb j a i d 55.9 50.8 h g = d + 0.2 to 0.4 mm e r0.5 r0.5 b min max k f (g = hole in the pcb) 10 max c
ordering information STTH310 6/7 doc id 9346 rev 3 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode STTH310s s10 smc 0.245 g 2500 tape and reel STTH310 STTH310 do-201ad 1.16 g 600 ammopack STTH310rl STTH310 do-201ad 1.16 g 1900 tape and reel STTH310-c2 stth 310 do-201ad c2 1.12 g 500 box table 10. document revision history date revision changes jan-2003 1 first release. 03-apr-2007 2 do-201ad c2 package added. smc package information updated. 07-dec-09 3 updated ta b l e 6 package dimensions.
STTH310 doc id 9346 rev 3 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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